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SemiChem APM Applications
The SemiChem APM is ideally suited for nearly every wet chemical process in the semiconductor, flat panel, and solar industries. The most common applications are:
- Hydrogen Peroxide in Copper CMP and Tungsten CMP.
- Low levels of HF, Sulfuric Acid & Hydrogen Peroxide in DSP+ Resist Removal.
- Dilute HF, HCI, Ammonia & Hydrogen Peroxide in SC1 & SC2 Processes.
- Extreme precision for dilute and concentrated TMAH in developers.
- Hot Phosphoric Acid in Nitride Etch.
- A variety of Acids & Bases in cleaning and etching processes
- Copper and Hydrogen Peroxide in flat panel Copper Etching.
- HF and NH4F in BOE.
- Phosphoric Acid and Hydrogen Peroxide in Copper UBM packaging.
The SemiChem APM have been successfully installed in a wide variety of applications. If you don’t see yours, please contact GMT, Inc.
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